Ratio 1:
Ingredients:
Binder: 40%
Pigments: 30%
Eippon HEMC: 1%
Solvents: 29%
Analysis:
In this formulation, Eippon HEMC is added at 1% to enhance the coating’s viscosity, flow properties, and film formation. This ratio provides a well-balanced composition with improved coating adhesion, excellent leveling, and good resistance to sagging. The presence of Eippon HEMC contributes to better film integrity and durability.
Ratio 2:
Ingredients:
Binder: 45%
Pigments: 25%
Eippon HEMC: 2%
Solvents: 28%
Analysis:
Ratio 2 increases the concentration of Eippon HEMC to 2% in the coating formulation. This higher dosage of HEMC improves the rheological properties, resulting in enhanced film build, improved brushability, and reduced splattering during application. It also contributes to better hiding power and wet adhesion. However, it should be noted that excessive HEMC content may slightly increase the drying time of the coating.
Ratio 3:
Ingredients:
Binder: 50%
Pigments: 20%
Eippon HEMC: 0.5%
Solvents: 29.5%
Analysis:
In this formulation, a lower concentration of Eippon HEMC at 0.5% is used. The reduced amount of HEMC may slightly affect the viscosity and leveling properties compared to the higher ratios. However, it still provides improved brushability and film formation, ensuring good adhesion and durability. The higher percentage of binder in this ratio contributes to better coverage and color retention.
Overall, the selection of the formulation ratio depends on the specific coating requirements and desired properties. Ratio 1 offers a balanced composition with improved adhesion and leveling properties. Ratio 2 emphasizes enhanced film build and brushability. Ratio 3 provides a cost-effective option with slightly compromised viscosity and leveling properties. Careful consideration of the coating’s intended use and performance expectations will aid in determining the most suitable formulation ratio with Eippon HEMC.
